|
PROCESS
PARAMETERS
- Hermetic
sealing from rough to high vacuums of 10-9 mbar or
better
- Standard
positive pressure capability of 2 bar, higher pressures optional
- Reactive gas
compatible with appropriate magnetic fluid
- Wide speed
range from indexing to many thousands of rev/min
- Low friction,
slip-stick free rotation with high torque transmission
FEEDTHROUGH
FEATURES
- Leak rate of
1.0 x 10-12 standard cc helium/second
- Maintenance
free, life of 3 years or longer depending on process
- Water-cooled
for high temperature compatibility and cantilevered for aggressive
processes
- Designs such
as, module seals, cartridge seals or coaxial shaft seals are available
- Hollow shaft
seals for passage of services, water, power or signals, into vacuum
chamber
- Non-contaminating
high reliability design
APPLICATION AREAS
Magnetic
fluid seals have achieved global acceptance following extensive use in
computer disk drives, vacuum processing, semiconductor and other
industries.
SEMICONDUCTOR
USAGE
Many
semiconductor fabrication techniques use high vacuum equipment. Production
equipment is usually single process. R&D and cluster tools often carry
out single and multiple processes and a piece of equipment may use a
variety of feedthroughs. Some perform simple tasks, such as rotation,
whilst others perform multi-function roles, such as rotation and
transportation of services in to the vacuum chamber.
INDUSTRIAL
USAGE
The
industrial use of magnetic fluid feedthroughs and seals falls into two
categories:
1.
Industrial procedures that involve the use of high vacuum processing
equipment
2.
Processing techniques that require a low friction, hermetic seal which
excludes particulate or gases, not necessarily under vacuum.
SEAL
FUNCTIONS
Provides
rotary motion into a vacuum or process chamber or a load lock.
Hermetically
seals the chamber and maintain vacuum and/or pressure integrity.
Introduces
process gases and/or coolants in to the chamber or wafer support
mechanisms.
Provides
particulate exclusion seal in robotic wafer transport mechanisms or other
sensitive areas.
Provides
very low friction, smooth rotary motion with maximum torque transmission.
PROCESSES
- Ion
implantation
- Ion beam and
RF etching
- Epi
deposition
- PVD (Physical
Vapor Deposition – sputtering, electron beam gun)
- CVD (Chemical
Vapor Deposition)
- MOCVD (Metal
Organic Chemical Vapor Deposition)
APPLICATION
AREAS
- Vacuum
furnaces and heat treatment equipment
- Excimer and
CO2 lasers
- Land and
airborne surveillance, guidance and sensor systems
- X-ray
rotating anode generators
- Gas unions
for the manufacture of high efficiency lamps
- Fibre optic
pre-form manufacture
Other
areas that can benefit from this technology are:
- Environmental
seals
- Aerospace
& defence
- Laser systems
|
